JPH0715149Y2 - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPH0715149Y2 JPH0715149Y2 JP1990019659U JP1965990U JPH0715149Y2 JP H0715149 Y2 JPH0715149 Y2 JP H0715149Y2 JP 1990019659 U JP1990019659 U JP 1990019659U JP 1965990 U JP1965990 U JP 1965990U JP H0715149 Y2 JPH0715149 Y2 JP H0715149Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- adhesive
- integrated circuit
- sealing container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990019659U JPH0715149Y2 (ja) | 1990-02-28 | 1990-02-28 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990019659U JPH0715149Y2 (ja) | 1990-02-28 | 1990-02-28 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03110874U JPH03110874U (en]) | 1991-11-13 |
JPH0715149Y2 true JPH0715149Y2 (ja) | 1995-04-10 |
Family
ID=31522765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990019659U Expired - Lifetime JPH0715149Y2 (ja) | 1990-02-28 | 1990-02-28 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0715149Y2 (en]) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147250U (ja) * | 1982-03-26 | 1983-10-03 | 三菱電機株式会社 | パツケ−ジ |
JPS63204794A (ja) * | 1987-02-20 | 1988-08-24 | 松下電器産業株式会社 | キヤビネツト |
JPS63253695A (ja) * | 1987-04-10 | 1988-10-20 | 日本電気株式会社 | 電気機器用筐体の封止方法 |
JPS6461996A (en) * | 1987-09-01 | 1989-03-08 | Fujitsu Ltd | Fixing method of printed board |
-
1990
- 1990-02-28 JP JP1990019659U patent/JPH0715149Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH03110874U (en]) | 1991-11-13 |
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